The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7968801 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 28, 2011

Filed:

Jan. 25, 2008
Applicant:

Kazuo Kinoshita, Hiroshima, JP;

Inventor:

Kazuo Kinoshita, Hiroshima, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

The camera module structure () of the present invention is arranged such that a board electrode () of a printed board () and a mounting electrode () of a camera module () mounted on the printed board () are joined with each other through a solder joint section (), and the board electrode () and the mounting electrode () are aligned by self-alignment. The solder joint section () includes a solder section () for solder-joining, and a supporting section () for supporting the camera module (). The present invention realizes a solder mounting structure wherein a heavy-weight component is joined on the board with solder by self-alignment.


Find Patent Forward Citations

Kinoshita, Kazuo. (2011). Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure (U.S. Patent No. 7968801). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7968801

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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