The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Jan. 28, 2005
Dirk Goldschmidt, Moers, DE;
Matthias Oechsner, Mülheim an der Ruhr, DE;
Michael Ott, Mülheim an der Ruhr, DE;
Uwe Paul, Ratingen, DE;
Ursula Pickert, Mülheim an der Ruhr, DE;
Eckart Schumann, Mülheim an der Ruhr, DE;
Beate Seiler, Sint-Gillis-Waas, BE;
Robert Singer, Erlangen, DE;
Jan Steinbach, Berlin, DE;
Andreas Volek, Erlangen, DE;
Volker Vosberg, Mülheim an der Ruhr, DE;
Dirk Goldschmidt, Moers, DE;
Matthias Oechsner, Mülheim an der Ruhr, DE;
Michael Ott, Mülheim an der Ruhr, DE;
Uwe Paul, Ratingen, DE;
Ursula Pickert, Mülheim an der Ruhr, DE;
Eckart Schumann, Mülheim an der Ruhr, DE;
Beate Seiler, Sint-Gillis-Waas, BE;
Robert Singer, Erlangen, DE;
Jan Steinbach, Berlin, DE;
Andreas Volek, Erlangen, DE;
Volker Vosberg, Mülheim an der Ruhr, DE;
Siemens Aktiengesellschaft, Munich, DE;
MTU Aero Engines GmbH, Munich, DE;
Abstract
The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.