The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Apr. 06, 2009
Levi A. Campbell, Poughkeepsie, NY (US);
Richard C. Chu, Hopewell Junction, NY (US);
Michael J. Ellsworth, Jr., Lagrangeville, NY (US);
Maurice F. Holahan, Lake City, MN (US);
Madhusudan K. Iyengar, Woodstock, NY (US);
Robert E. Simons, Pouhkeepsie, NY (US);
Rebecca N. Wagner, Torrance, CA (US);
Levi A. Campbell, Poughkeepsie, NY (US);
Richard C. Chu, Hopewell Junction, NY (US);
Michael J. Ellsworth, Jr., Lagrangeville, NY (US);
Maurice F. Holahan, Lake City, MN (US);
Madhusudan K. Iyengar, Woodstock, NY (US);
Robert E. Simons, Pouhkeepsie, NY (US);
Rebecca N. Wagner, Torrance, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coupling to the heat generating components including the DIMM array(s). The first plate side has a coolant conduit connected at one end to a supply manifold via flexible tubing and at another end to a return manifold via another flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through said first plate's conduit.