The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7964975 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 21, 2011

Filed:

Jan. 29, 2009
Applicants:

Ryoichi Kajiwara, Hitachi, JP;

Shigehisa Motowaki, Mito, JP;

Kazutoshi Itou, Hitachi, JP;

Hiroshi Hozoji, Hitachiota, JP;

Inventors:

Ryoichi Kajiwara, Hitachi, JP;

Shigehisa Motowaki, Mito, JP;

Kazutoshi Itou, Hitachi, JP;

Hiroshi Hozoji, Hitachiota, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); B05D 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A fabrication method for a metal-base/polymer-resin bonded structured body according to the present invention includes the steps of: (1) applying, to a surface of the metal base, a solution containing an organometallic compound decomposable at 350° C. or lower; (2) baking the applied solution in an oxidizing atmosphere to form, on the surface of the metal base, a coating containing an oxide of the metal of the organometallic compound; (3) providing the polymer resin on the coating; and (4) hardening the polymer resin to provide the metal-base/polymer-resin bonded structured body.


Find Patent Forward Citations

Kajiwara, Ryoichi. (2011). Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them (U.S. Patent No. 7964975). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7964975

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