The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Aug. 20, 2008
Jin Mun Ryu, Hwaseong-Si, KR;
Jung Seok Lee, Suwon-Si, KR;
Hyung Kyu Park, Suwon-Si, KR;
BO Kyoung Kim, Suwon-Si, KR;
Yun Seok Woo, Gunpo-Si, KR;
Jung Jin Kim, Hwaseong-Si, KR;
Jin Mun Ryu, Hwaseong-Si, KR;
Jung Seok Lee, Suwon-Si, KR;
Hyung Kyu Park, Suwon-Si, KR;
Bo Kyoung Kim, Suwon-Si, KR;
Yun Seok Woo, Gunpo-Si, KR;
Jung Jin Kim, Hwaseong-Si, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-do, KR;
Abstract
A glass cap molding package includes a substrate with an external connection terminal formed on a peripheral region of a top surface; an image sensor mounted on the top surface of the substrate; a transparent member installed on an upper part of the image sensor; and a molding unit formed to seal the image sensor and the transparent member. The mold unit exposes the external connection terminal of the substrate to a lateral surface of the substrate. The glass cap molding package and a manufacturing method thereof and a camera module including the same reduce a manufacturing cost and improve productivity by manufacturing a small module in comparison with a conventional module and simplifying a process.