The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Sep. 22, 2008
Osamu Ikeda, Yokohama, JP;
Masato Nakamura, Fujisawa, JP;
Satoshi Matsuyoshi, Takahagi, JP;
Koji Sasaki, Tsuchiura, JP;
Shinji Hiramitsu, Kashiwa, JP;
Osamu Ikeda, Yokohama, JP;
Masato Nakamura, Fujisawa, JP;
Satoshi Matsuyoshi, Takahagi, JP;
Koji Sasaki, Tsuchiura, JP;
Shinji Hiramitsu, Kashiwa, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a CuSncontent greater than a eutectic content.