The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Dec. 06, 2007
Applicants:
Yukiko Haraguchi, Fukuoka, JP;
Takahiro Kumakawa, Kyoto, JP;
Takashi Yui, Shiga, JP;
Kazumi Watase, Fukui, JP;
Inventors:
Yukiko Haraguchi, Fukuoka, JP;
Takahiro Kumakawa, Kyoto, JP;
Takashi Yui, Shiga, JP;
Kazumi Watase, Fukui, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 21/82 (2006.01);
U.S. Cl.
CPC ...
Abstract
A modified layerand an altered layerare formed outside a dicing point of a dicing areaThus without forming another interface between different physical properties on the dicing point, it is possible to prevent chipping from progressing along a crystal orientation from an interface between a semiconductor elementand a semiconductor substrateand from a surface of the semiconductor element during dicing, thereby suppressing the development of chipping to the semiconductor element.