The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Jul. 30, 2007
Fielder Stanton Lyons, Phoenix, AZ (US);
Jeffrey A. Mears, Chandler, AZ (US);
Gene C. Weedon, Richmond, VA (US);
Kenneth C. Harding, Midlothian, VA (US);
Lisa Owen, Charlotte, NC (US);
Peter Anthony Russell, Liberty Township, OH (US);
Joseph Mitchell, Charlotte, NC (US);
Fielder Stanton Lyons, Phoenix, AZ (US);
Jeffrey A. Mears, Chandler, AZ (US);
Gene C. Weedon, Richmond, VA (US);
Kenneth C. Harding, Midlothian, VA (US);
Lisa Owen, Charlotte, NC (US);
Peter Anthony Russell, Liberty Township, OH (US);
Joseph Mitchell, Charlotte, NC (US);
BAE Systems Tensylon H.P.M., Inc., Monroe, NC (US);
Abstract
A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.