The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2011

Filed:

Mar. 28, 2006
Applicants:

Ryosuke Matsui, Kyoto, JP;

Isao Manabe, Otsu, JP;

Yosuke Takizawa, Gifu, JP;

Saori Sumi, Otsu, JP;

Masahiro Kimura, Kyoto, JP;

Inventors:

Ryosuke Matsui, Kyoto, JP;

Isao Manabe, Otsu, JP;

Yosuke Takizawa, Gifu, JP;

Saori Sumi, Otsu, JP;

Masahiro Kimura, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 15/09 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A biaxially oriented polyester film includes at least three polyester resin layers A1/B/A2, and has a melting point in the range of 246 to 270° C. The major component of the layers A1 and A2 is polyethylene terephthalate and the stress at 100% elongation in the film's longitudinal direction and width direction at 150° C. and 200° C. meets the following equations: 2≦(F100+F100)≦100 and 1≦F100≦60. The film has a high dimensional stability at high temperatures to permit uniform metal deposition, suffers little change in appearance during thermoforming, and serves for easy production of formed parts that closely meet the shape of the die when subjected to low-stress forming.


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