The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Dec. 23, 2008
Ming-yue Chen, Tu-cheng, TW;
Been-yang Liaw, Tu-cheng, TW;
Wen-yi Hsieh, Tu-cheng, TW;
Shih-wei Hsiao, Tu-cheng, TW;
Ming-Yue Chen, Tu-cheng, TW;
Been-Yang Liaw, Tu-cheng, TW;
Wen-Yi Hsieh, Tu-cheng, TW;
Shih-Wei Hsiao, Tu-cheng, TW;
Hon Hai Precision Ind. Co., Ltd, New Taipei, TW;
Abstract
A burn-in socket for receiving an IC package comprises a socket body, a plurality of contacts mounted in the socket body and an actuator movably mounted upon the socket body. Each contact in the socket body includes a pair of clipping arms with tip portions at free ends thereof respectively. Solder balls attached to the bottom of the IC package are respectively clipped between the pair of the tip portions and thus the IC package should be brought into electrical contact with the contacts of the burn-in socket. The tip portion is plated with a Pd—Co layer for reducing the attachment of the Sn and preventing the impedance of the contacts to increase. Meanwhile, the IC package can be sucked up successfully without absorption from the contacts of the burn-in socket.