The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Mar. 31, 2009
Chad C Schmidt, Menlo Park, CA (US);
Richard Lidio Blanco, Jr., Santa Clara, CA (US);
Douglas L Heirich, Palo Alto, CA (US);
Michael D Hillman, Los Altos, CA (US);
Phillip L Mort, Santa Clara, CA (US);
Jay S Nigen, Santa Clara, CA (US);
Gregory L Tice, Los Altos, CA (US);
Chad C Schmidt, Menlo Park, CA (US);
Richard Lidio Blanco, Jr., Santa Clara, CA (US);
Douglas L Heirich, Palo Alto, CA (US);
Michael D Hillman, Los Altos, CA (US);
Phillip L Mort, Santa Clara, CA (US);
Jay S Nigen, Santa Clara, CA (US);
Gregory L Tice, Los Altos, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.