The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Sep. 05, 2007
Erich W. Gerbsch, Cicero, IN (US);
Robert D. Maple, Fishers, IN (US);
Monty B. Hayes, Kokomo, IN (US);
Robert J. Campbell, Noblesville, IN (US);
Erich W. Gerbsch, Cicero, IN (US);
Robert D. Maple, Fishers, IN (US);
Monty B. Hayes, Kokomo, IN (US);
Robert J. Campbell, Noblesville, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A semiconductor power module includes a semiconductor chip thermally interfaced to a ceramic substrate and a leadframe defined by a flexible circuit disposed intermediate the chip and the ceramic substrate. The flexible circuit includes a conductor layer that is selectively encased in an insulated jacket to ensure adequate electrical insulation between the conductor layer and adjacent conductive surfaces. Preferably, the module is constructed for double side cooling by sandwiching the chip between a pair of ceramic substrates and providing intermediate flexible circuit leadframes on both sides of the chip for electrically accessing the chip terminals.