The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7960806 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 14, 2011

Filed:

Oct. 01, 2008
Applicants:

Young-ki Lee, Hwaseong-si, KR;

Seog-moon Choi, Seoul, KR;

Hyung-jin Jeon, Gunpo-si, KR;

Sang-hyun Shin, Hwaseong-si, KR;

Inventors:

Young-Ki Lee, Hwaseong-si, KR;

Seog-Moon Choi, Seoul, KR;

Hyung-Jin Jeon, Gunpo-si, KR;

Sang-Hyun Shin, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sub-mount, a light emitting diode package, and a method of manufacturing thereof are disclosed. A sub-mount, on which multiple light emitting diodes are mounted, can include a multiple number of metal bodies on which the light emitting diodes are respectively mounted, and an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other but electrically disconnected from each other. By utilizing certain embodiments of the invention, a high heat releasing effect may be obtained, and manufacturing costs may be reduced.


Find Patent Forward Citations

Lee, Young-Ki. (2011). Sub-mount, light emitting diode package and manufacturing method thereof (U.S. Patent No. 7960806). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7960806

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