The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Jun. 23, 2004
Yoshifumi Adachi, Himeji, JP;
Takahiro Kitano, Himeji, JP;
Shinichi Fujino, Himeji, JP;
Katsuyuki Wada, Himeji, JP;
Kazushi Torii, Himeji, JP;
Taku Iwamura, Himeji, JP;
Sayaka Machida, Himeji, JP;
Yoshifumi Adachi, Himeji, JP;
Takahiro Kitano, Himeji, JP;
Shinichi Fujino, Himeji, JP;
Katsuyuki Wada, Himeji, JP;
Kazushi Torii, Himeji, JP;
Taku Iwamura, Himeji, JP;
Sayaka Machida, Himeji, JP;
Nippon Shokubai Co., Ltd., Osaka, JP;
Abstract
The production method of a water absorbent resin composition including a particulate water absorbent resin, wherein: 95 wt % or more of particles whose particle diameter is less than 850 μm and not less, than 106 μm are contained, and a weight average particle diameter of the particles is less than 500 μm and not less than 300 μm and a logarithmic standard deviation (σξ) of a particle size distribution is 0.45 or less, and a water-soluble component of the water absorbent composition is 35 wt % or less, and a multivalent metal component is contained, and an extraction rate of the multivalent metal component is 5.0 wt % or more and less than 100 wt %, thereby providing the water absorbent resin composition, free from any coagulation of particles in high humidity, which has superior absorbent property in terms of an absorbency and a diffusing absorbency under pressure.