The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Sep. 04, 2008
Applicants:
Hideki Takehara, Hyogo, JP;
Yoshihiro Tomita, Osaka, JP;
Seiji Fujiwara, Kyoto, JP;
Takahiro Nakano, Kyoto, JP;
Hikari Sano, Hyogo, JP;
Inventors:
Hideki Takehara, Hyogo, JP;
Yoshihiro Tomita, Osaka, JP;
Seiji Fujiwara, Kyoto, JP;
Takahiro Nakano, Kyoto, JP;
Hikari Sano, Hyogo, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides a semiconductor device that can suppresses poor connection caused by the variation of the heights of bumps during reflow heating, can be applied to a narrow array pitch, and can freely adjust the heights of the bumps.