The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Jan. 31, 2005
Tan Xiaochun, Shanghai, CN;
Jiang Xiaolan, Shanghai, CN;
Tan Xiaochun, Shanghai, CN;
Jiang Xiaolan, Shanghai, CN;
Diodes, Inc., Westlake Village, CA (US);
Abstract
A Conductive Epoxy Coating ('CEC') process is provided for assembling semiconductor devices. The CEC process includes application of a conductive epoxy coating prior to wafer dicing and instead of dispensing epoxy/solder when performing die bonding. The CEC process generally begins with a silicon wafer. Processing of the silicon wafer includes coupling a conductive epoxy layer to a first side of the semiconductor wafer to form a coated wafer. The process cures the coated wafer and forms die from the coated wafer. The process further couples an exposed side of the conductive epoxy layer of the die to a lead frame to form a semiconductor device, and cures the semiconductor device.