The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Jul. 18, 2006
Applicants:
Philippe L. L. Cauvet, Caen, FR;
Herve Fleury, Caen, FR;
Fabrice Verjus, Creully, FR;
Inventors:
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01); G01R 27/26 (2006.01); G01R 31/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract
A system in package () has a, preferably wireless, test controller () for testing each die () after it has been mounted onto the substrate of the system in package (), and a faulty die () is repaired before a next die () is mounted onto the substrate (). This way, the system in package () can be tested during the intermediate stages of its manufacturing, thus ensuring that all dies () function correctly before sealing the dies in the single package. Consequently, a method for manufacturing a system in package () is obtained that has an improved yield compared to known manufacturing methods.