The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2011

Filed:

Dec. 05, 2007
Applicants:

Chang-hoon Sim, Seoul, KR;

Ki-jeong Moon, Seoul, KR;

Hae-sang Jun, Seoul, KR;

Jun-ho Lee, Uijeongbu-si, KR;

Yun-min Park, Seoul, KR;

Inventors:

Chang-Hoon Sim, Seoul, KR;

Ki-Jeong Moon, Seoul, KR;

Hae-Sang Jun, Seoul, KR;

Jun-Ho Lee, Uijeongbu-si, KR;

Yun-Min Park, Seoul, KR;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.


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