The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Mar. 27, 2008
Tsuneo Takano, Toyohashi, JP;
Akitada Yanase, Toyohashi, JP;
Tadashi Sakai, Tokyo, JP;
Kiharu Numata, Toyohashi, JP;
Akihiro Ito, Toyohashi, JP;
Masato Taguchi, Tokyo, JP;
Junichi Muramatsu, Toyohashi, JP;
Kazuya Goto, Irvine, CA (US);
Kazuki Koga, Toyohashi, JP;
Tsuneo Takano, Toyohashi, JP;
Akitada Yanase, Toyohashi, JP;
Tadashi Sakai, Tokyo, JP;
Kiharu Numata, Toyohashi, JP;
Akihiro Ito, Toyohashi, JP;
Masato Taguchi, Tokyo, JP;
Junichi Muramatsu, Toyohashi, JP;
Kazuya Goto, Irvine, CA (US);
Kazuki Koga, Toyohashi, JP;
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Abstract
An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.