The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2011
Filed:
Aug. 19, 2009
Richard Barina, Sebring, FL (US);
Bruce Desrosiers, Oxford, NC (US);
Michael French, Raleigh, NC (US);
David L. Hager, Wake Forest, NC (US);
Michael S. June, Raleigh, NC (US);
John P. Scavuzzo, Cary, NC (US);
Scott Womble, Hillsborough, NC (US);
Richard Barina, Sebring, FL (US);
Bruce Desrosiers, Oxford, NC (US);
Michael French, Raleigh, NC (US);
David L. Hager, Wake Forest, NC (US);
Michael S. June, Raleigh, NC (US);
John P. Scavuzzo, Cary, NC (US);
Scott Womble, Hillsborough, NC (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module includes a handle pivotally secured to opposing sides of the heatsink body, and bails pivotally secured to the handle. In addition, the bails extend downward to dispose a lower bail member adjacent the spring loaded latches. As the handle pivots between a first position to raise the bails and a second position to lower the bails, the bails automatically move from a locked position to an unlocked position. Each of the spring loaded latches include a hook and at least one pre-loaded spring to transfer a minimum downforce to the lower bail members when the bails are raised. Accordingly, embodiments may be operated from the top of the heatsink without the use of tools, while providing a desired downforce over a range of heatsink heights.