The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2011

Filed:

Oct. 12, 2007
Applicants:

Hideyuki Hirakoso, Yokohama, JP;

Keisuke Abe, Yokohama, JP;

Yasuhiro Sanada, Yokohama, JP;

Inventors:

Hideyuki Hirakoso, Yokohama, JP;

Keisuke Abe, Yokohama, JP;

Yasuhiro Sanada, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide an ink composition capable of forming a metallic material which is excellent in adhesion to a substrate and free from ion migration. An ink composition having fine metallic copper particles and/or fine copper hydride particles, and fine silver oxide particles or fine metallic silver particles, dispersed in a water-insoluble organic liquid, which composition has a solid content concentration of from 10 to 80 mass % and contains from 5 to 90 parts by mass of the fine metallic copper particles and/or fine copper hydride particles, and from 10 to 95 parts by mass of the fine silver oxide particles or fine metallic silver particles, per 100 parts by mass of the total solid content in the ink composition.


Find Patent Forward Citations

Loading…