The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7955892 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 07, 2011

Filed:

Nov. 25, 2007
Applicant:

Sharad M. Shah, San Jose, CA (US);

Inventor:

Sharad M. Shah, San Jose, CA (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01R 12/00 (2006.01); H01R 13/64 (2006.01); H01R 13/62 (2006.01); H05K 7/00 (2006.01); H05K 7/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Various sockets for multiple sizes of chip package substrates are disclosed. In one aspect, an apparatus is provided that includes a socket that has a peripheral wall defining an interior space adapted to receive either of a first semiconductor chip package substrate and a second semiconductor chip package substrate. The first semiconductor chip package substrate has a first size and a first plurality of structural features and the second semiconductor chip package substrate has a second size different than the first size and a second plurality of structural features. The socket has a third plurality of structural features operable to engage the structural features of either of semiconductor chip package substrates to selectively enable the first semiconductor chip package substrate to be located at a first preselected position in the interior space and the second semiconductor chip package substrate to be located at a second preselected position in the interior space.


Find Patent Forward Citations

Shah, Sharad. (2011). Multiple size package socket (U.S. Patent No. 7955892). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7955892

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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