The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2011
Filed:
Jul. 10, 2007
Applicants:
Kenji Takai, Oyama, JP;
Takayuki Sueyoshi, Kodaira, JP;
Inventors:
Kenji Takai, Oyama, JP;
Takayuki Sueyoshi, Kodaira, JP;
Assignee:
Hitachi Chemical Co, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.