The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2011
Filed:
Jan. 23, 2008
Feng-ku Wang, Taipei, TW;
Chih-kai Yang, Taipei, TW;
Huang-cheng KE, Taipei, TW;
Yu-chih Cheng, Taipei, TW;
Cheng-shang Chou, Taipei, TW;
Feng-Ku Wang, Taipei, TW;
Chih-Kai Yang, Taipei, TW;
Huang-Cheng Ke, Taipei, TW;
Yu-Chih Cheng, Taipei, TW;
Cheng-Shang Chou, Taipei, TW;
Inventec Corporation, Taipei, TW;
Abstract
A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.