The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2011

Filed:

Aug. 08, 2008
Applicants:

Chad A. Mirkin, Wilmette, IL (US);

Yuhuang Wang, Evanston, IL (US);

Louise R. Giam, Chicago, IL (US);

Matthew Park, Evanston, IL (US);

Inventors:

Chad A. Mirkin, Wilmette, IL (US);

Yuhuang Wang, Evanston, IL (US);

Louise R. Giam, Chicago, IL (US);

Matthew Park, Evanston, IL (US);

Assignee:

Northwestern University, Evanston, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01Q 60/38 (2010.01);
U.S. Cl.
CPC ...
Abstract

An improved method of loading tips and other surfaces with patterning compositions or inks for use in deposition. A method of patterning is described, the method comprising: (i) providing at least one array of tips; (ii) providing a plurality of patterning compositions; (iii) ink jet printing at least some of the patterning compositions onto some of the tips; and (iv) depositing at least some of the patterning compositions onto a substrate surface; wherein the ink jet printing is adapted to prevent substantial cross-contamination of the patterning composition on the tips. Good printing reproducibility and control of printing rate can be achieved. The surfaces subjected to ink jet printing can be treated to encourage localization of the ink at the tip. The method is particularly important for high density arrays.


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