The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2011

Filed:

May. 01, 2007
Applicants:

Nobuhito Yamaguchi, Tokyo, JP;

Yuji Tsuruoka, Kawasaki, JP;

Takashi Mori, Tokyo, JP;

Masao Furukawa, Yokohama, JP;

Seiichi Kamiya, Yokohama, JP;

Inventors:

Nobuhito Yamaguchi, Tokyo, JP;

Yuji Tsuruoka, Kawasaki, JP;

Takashi Mori, Tokyo, JP;

Masao Furukawa, Yokohama, JP;

Seiichi Kamiya, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating portions, and conductive portions connected to the electronic circuit parts, the plurality of electronic circuit parts, the insulating portions, and the conductive portions being integrally held on the base material. Wires are composed of a stack of the conductive portions and extend in a direction crossing a surface of the base material and in a direction crossing a direction perpendicular to the base material surface to electrically connect the plurality of electronic circuit parts together.


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