The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2011
Filed:
Sep. 11, 2008
Tomoki Kawasaki, Kyoto, JP;
Yuichiro Yamada, Ohtsu, JP;
Toshiyuki Fukuda, Nagaokakyou, JP;
Shuichi Ogata, Takatsuki, JP;
Tomoki Kawasaki, Kyoto, JP;
Yuichiro Yamada, Ohtsu, JP;
Toshiyuki Fukuda, Nagaokakyou, JP;
Shuichi Ogata, Takatsuki, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads () in a mounting area for a semiconductor element () and adhering the semiconductor element () to the heat sink () via the die pads (), space is opened up between the semiconductor element () and the heat sink () for sealing resin () to run into.