The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2011

Filed:

May. 29, 2007
Applicants:

Rajmohan Bhandari, Salt Lake City, UT (US);

Sandeep Negi, Salt Lake City, UT (US);

Florian Solzbacher, Salt Lake City, UT (US);

Richard A. Normann, Park City, UT (US);

Inventors:

Rajmohan Bhandari, Salt Lake City, UT (US);

Sandeep Negi, Salt Lake City, UT (US);

Florian Solzbacher, Salt Lake City, UT (US);

Richard A. Normann, Park City, UT (US);

Assignee:

University of Utah Research Foundation, Salt Lake City, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 3/00 (2006.01); B44C 1/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods for wafer-scale fabrication of needle arrays can include mechanically modifying a wafer to produce a plurality of vertically-extending columns. The columns are etched to round and reshape the columns into substantially uniformly shaped needles. Needle arrays having needle width non-uniformity of less than about 3% and length non-uniformity of less than about 2% can be produced.


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