The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2011
Filed:
Sep. 13, 2005
Guy Enouf, Saint-Sylvain, FR;
Xavier Borde, Rennes, FR;
Florian Demaimay, Rennes, FR;
Oberthur Technologies, Levallois-Perret, FR;
Abstract
Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component () having connection pads, whereof one predetermined pad (A) is provided with a bump (); providing a support having () to the predetermined pad via the bump; aligning the predetermined pad provided with the bump with the terminal; contacting the bump and the terminal and assembling them in specific temperature and pressure conditions. Prior to contacting and fixing the bump and the terminal, the surface of the terminal is covered with an insulating layer (), the insulating layer being a material selected so as to be traversed by the bump in the temperature and pressure conditions.