The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2011
Filed:
Oct. 20, 2008
Yong-hwan Kwon, Suwon-si, KR;
Un-byoung Kang, Hwaseong-si, KR;
Chung-sun Lee, Gunpo-si, KR;
Woon-seong Kwon, Seoul, KR;
Hyung-sun Jang, Suwon-si, KR;
Yong-Hwan Kwon, Suwon-si, KR;
Un-Byoung Kang, Hwaseong-si, KR;
Chung-Sun Lee, Gunpo-si, KR;
Woon-Seong Kwon, Seoul, KR;
Hyung-Sun Jang, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A camera module includes an image sensor chip, a lens structure, a transparent substrate, an adhesive portion, and a light blocking layer. The image sensor chip includes a light receiving area and a circuit area. The lens structure is positioned on the image sensor chip and configured to allow light to enter the image sensor chip. The transparent substrate is positioned between the image sensor chip and the lens structure, the transparent substrate allowing light from the lens structure to enter the light receiving area. The adhesive portion attaches the image sensor chip and the transparent substrate, and covers the circuit area. The light blocking layer is attached to the transparent substrate to block light from entering the circuit area.