The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2011

Filed:

Apr. 09, 2008
Applicants:

Ralph Murray Begun, Raleigh, NC (US);

Raymond Mathew Clemo, Raleigh, NC (US);

Karl Klaus Dittus, Durham, NC (US);

Vinod Kamath, Raleigh, NC (US);

Michael Sven Miller, Raleigh, NC (US);

Warren Everett Price, Cary, NC (US);

Whitcomb Randolph Scott, Iii, Chapel Hill, NC (US);

Inventors:

Ralph Murray Begun, Raleigh, NC (US);

Raymond Mathew Clemo, Raleigh, NC (US);

Karl Klaus Dittus, Durham, NC (US);

Vinod Kamath, Raleigh, NC (US);

Michael Sven Miller, Raleigh, NC (US);

Warren Everett Price, Cary, NC (US);

Whitcomb Randolph Scott, III, Chapel Hill, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H02P 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system comprising a chassis that includes a plurality of modules and a fan assembly disposed in a distal end of the chassis for drawing air in parallel pathways through the plurality of modules. At least one of the modules is a compute module having a thermal sensor disposed to sense the temperature of air flowing across a processor mounted on a motherboard. The system further comprises a fan controller receiving output from the thermal sensor, wherein the fan controller operates the fan assembly to cool the plurality of modules and maintain the thermal sensor output within an operating temperature range. The fan controller controls the fan speed according to predetermined thermal profile settings associated with one of the compute modules received in the chassis. For example, the predetermined thermal profile settings may include a minimum fan speed, a maximum fan speed, and control loop feedback settings.


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