The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2011
Filed:
Dec. 29, 2006
Yoshio Ozeki, Yokohama, JP;
Toshiaki Takai, Yokohama, JP;
Makoto Ohta, Tottori, JP;
Takahiro Umeyama, Tottori, JP;
Yoshio Ozeki, Yokohama, JP;
Toshiaki Takai, Yokohama, JP;
Makoto Ohta, Tottori, JP;
Takahiro Umeyama, Tottori, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to 'a' μm, a thickness of the ceramic substrate is set to 'b' μm, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to “c” μm, a relationship of a≧269×c/b+151 is established.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile