The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Dec. 10, 2008
Applicant:
Yoko Kobayashi, Kawasaki, JP;
Inventor:
Yoko Kobayashi, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A reflow process evaluation device includes, a stress calculation part for calculating an average principal stress acting on a joint portion, wherein a principal stress occurs when a chip and a substrate are joined by solder with a reflow method and a rupture occurrence ratio computation part for computing an occurrence ratio at which the joint portion ruptures based on a relational expression between the occurrence ratio and the average principal stress acting on the joint portion and the average principal stress calculated by the stress calculation part.