The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2011

Filed:

Apr. 27, 2006
Applicants:

Hirofumi Miyajima, Shizuoka, JP;

Hirofumi Kan, Shizuoka, JP;

Nobuo Watanabe, Tokyo, JP;

Satoru Ooishi, Shizuoka, JP;

Nobutaka Suzuki, Shizuoka, JP;

Inventors:

Hirofumi Miyajima, Shizuoka, JP;

Hirofumi Kan, Shizuoka, JP;

Nobuo Watanabe, Tokyo, JP;

Satoru Ooishi, Shizuoka, JP;

Nobutaka Suzuki, Shizuoka, JP;

Assignee:

Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat sink has a first flat plate, a partition plate, and a second flat plate. The first flat plate has an upper surface in which a first recess is formed. The second flat plate has a lower surface in which a second recess is formed, and an upper surface on which a semiconductor laser element is mounted. These recesses form a part of a refrigerant channel. The partition plate has a lower surface covering the first recess, an upper surface covering the second recess, and at least one through hole having the first recess communicated with the second recess. The first flat plate and the second flat plate both have a first coefficient of thermal expansion. The partition plate has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion.


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