The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Oct. 27, 2006
Roelf Anco Jacob Groenhuis, Nijmegen, NL;
Paul Dijkstra, Eindhoven, NL;
Roelf Anco Jacob Groenhuis, Nijmegen, NL;
Paul Dijkstra, Eindhoven, NL;
NXP B.V., Eindhoven, NL;
Abstract
A die package () for a semiconductor die (). A plurality of the die packages () are formed on a single carrier () by applying a body () of molding compound across a carrier () with an air cavity () defined in the molding compound about each of a plurality of device regions () of the carrier (). After a semiconductor die () is attached inside the air cavity () of each device region () and electrically connected with at least one contact pad (), a cover () is applied to close all of the air cavities (). Following singulation, each semiconductor die () is located inside the sealed air cavity () of one die package (). The molding compound of each die package () may be locked against movement relative to the device region () of the carrier () by locking features (). The locking features () may constitute portions of contact pads () used to establish electrical communication paths from the semiconductor die () to the environment outside of the package ().