The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2011

Filed:

Sep. 25, 2007
Applicants:

Jong Hoon OH, Chapel Hill, NC (US);

Klaus Hummler, Apex, NC (US);

Oliver Kiehl, Charlotte, VT (US);

Josef Schnell, Charlotte, VT (US);

Wayne Frederick Ellis, Jericho, VT (US);

Jung Pill Kim, Cary, NC (US);

Lee Ward Collins, Cary, NC (US);

Octavian Beldiman, South Burlington, VT (US);

Inventors:

Jong Hoon Oh, Chapel Hill, NC (US);

Klaus Hummler, Apex, NC (US);

Oliver Kiehl, Charlotte, VT (US);

Josef Schnell, Charlotte, VT (US);

Wayne Frederick Ellis, Jericho, VT (US);

Jung Pill Kim, Cary, NC (US);

Lee Ward Collins, Cary, NC (US);

Octavian Beldiman, South Burlington, VT (US);

Assignee:

Qimonda AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the present invention generally provide techniques and apparatus for altering the functionality of a multi-chip package (MCP) without requiring entire replacement of the MCP. The MCP may be designed with a top package substrate designed to interface with an add-on package that, when sensed by the MCP, alters the functionality of the MCP.


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