The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2011

Filed:

Aug. 09, 2005
Applicant:

Seitaro Mizuhara, Kyoto, JP;

Inventor:

Seitaro Mizuhara, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A material board for producing a hybrid circuit board includes a plurality of hybrid circuit board sectionson each of which an electronic componentis mounted and a metallic terminal platefor external connection is bonded so as to project from the hybrid circuit board section. A frame portionis defined between the hybrid circuit board sections, and the hybrid circuit board sections are integrally connected to the frame portion via a thin stripprovided at an intermediate portion of grooveseach surrounding a respective one of the hybrid circuit board sections entirely. In bonding the terminal plateto the hybrid circuit board by soldering, the terminal plate is temporarily bonded to the frame portion 6 with an adhesive. The adhesive is prevented from spreading toward the end of the terminal plate. A hole or a recessis formed in the frame portionat a region with which the terminal plateis to overlap and which is closer to an end of the terminal plate than a portion to which the adhesivefor temporarily bonding the terminal plate to the frame portion is to be applied is.


Find Patent Forward Citations

Mizuhara, Seitaro. (2011). Material board for producing hybrid circuit board with metallic terminal plate and method for producing hybrid circuit board (U.S. Patent No. 7943860). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7943860

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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