The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Dec. 31, 2008
Roel Daamen, Herkenbosch, NL;
Robertus A. M. Wolters, Eindhoven, NL;
Martinus P. M. Maas, Budel, NL;
Pascal Bancken, Opwijk, BE;
Julien M. M. Michelon, Saint Cyr Sur Loire, FR;
Roel Daamen, Herkenbosch, NL;
Robertus A. M. Wolters, Eindhoven, NL;
Martinus P. M. Maas, Budel, NL;
Pascal Bancken, Opwijk, BE;
Julien M. M. Michelon, Saint Cyr Sur Loire, FR;
NXP B.V., Eindhoven, NL;
Abstract
A damascene process is described using a copper fill process to fill a trench (). The copper fill () is started with a deposited seed layer which includes () copper and titanium. Some titanium migrates to the surface during the copper fill process. The structure is annealed in a nitrogen atmosphere which creates a self-aligned TiN barrier () at the surface of the copper fill (). Air gaps () may be created in the same annealing process. The process may be used to form a multilayer structure.