The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2011

Filed:

Jan. 22, 2008
Applicants:

Daniel Francis, Oakland, CA (US);

Felix Ejeckam, San Francisco, CA (US);

John Wasserbauer, San Leandro, CA (US);

Firooz Faili, Los Gatos, CA (US);

Dubravko Babic, San Jose, CA (US);

Inventors:

Daniel Francis, Oakland, CA (US);

Felix Ejeckam, San Francisco, CA (US);

John Wasserbauer, San Leandro, CA (US);

Firooz Faili, Los Gatos, CA (US);

Dubravko Babic, San Jose, CA (US);

Assignee:

Group4 Labs, LLC, Menlo Park, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01);
U.S. Cl.
CPC ...
Abstract

Method for producing composite wafers with thin high-quality semiconductor films atomically attached to synthetic diamond wafers is disclosed. Synthetic diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited on bulk semiconductor wafer which has been prepared to allow separation of the thin semiconductor film from the remaining bulk semiconductor wafer. The remaining semiconductor wafer is available for reuse. The synthetic diamond substrate serves as heat spreader and a mechanical substrate.


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