The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Nov. 29, 2005
Junji Kurokawa, Higashiomi, JP;
Kazutsugu Kobayashi, Higashiomi, JP;
Motoaki Yoshida, Higashiomi, JP;
Masahiro Okumura, Higashiomi, JP;
Atsushi Ogasawara, Higashiomi, JP;
Tetsurou Abumita, Higashiomi, JP;
Takeshi Ogawa, Higashiomi, JP;
Masakazu Yasui, Higashiomi, JP;
Junji Kurokawa, Higashiomi, JP;
Kazutsugu Kobayashi, Higashiomi, JP;
Motoaki Yoshida, Higashiomi, JP;
Masahiro Okumura, Higashiomi, JP;
Atsushi Ogasawara, Higashiomi, JP;
Tetsurou Abumita, Higashiomi, JP;
Takeshi Ogawa, Higashiomi, JP;
Masakazu Yasui, Higashiomi, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A composite ceramic body and a method thereof are provided. The composite ceramic body comprising a first bonding body comprising a ceramic containing Si ingredient, and a second bonding body bonded to the first bonding body through a bonding material containing, as main ingredient, a Si compound which includes the element common to the Si ingredient contained in the first bonding body. The first and second bonding bodies can be bonded strongly and uniformly without any adhesive. Since the composite ceramic body has high bonding strength, it is applicable to microchemical chips and reformers.