The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Feb. 16, 2005
Toshihide Sekido, Otsu, JP;
Shigeo Iwasawa, Matsuyama, JP;
Tatsuya Senba, Iyo-gun, JP;
Toray Industries, Inc., , JP;
Abstract
An RTM molding method includes disposing a reinforcing fiber substrate in a cavity of a mold consisting of a plurality of dies, clamping the mold, and thereafter injecting resin to complete molding, characterized in that divided areas with respect to the surface direction of the reinforcing fiber substrate are assumed, each divided area is one in which injected resin expands over the entire surface in the area and can be substantially uniformly impregnated in the thickness direction of the substrate, and resin introducing paths are formed for respective assumed divided areas for introducing the injected resin into the respective divided areas; and an RTM molding device. When a relatively large molded product is to be molded, a molding step from resin injection to impregnating/curing can be implemented at high speed without generating a non-resin-flowing area, thereby enabling a high-quality molded product to be produced free from voids, etc., with a molding time shortened and production speed and volume increased.