The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Nov. 02, 2009
Yoshiaki Kudo, Nagano-ken, JP;
Takashi Hakoda, Nagano-ken, JP;
Kiyoshi Nakamura, Nagano-ken, JP;
Susumu Morozumi, Nagano-ken, JP;
Yoshiaki Kudo, Nagano-ken, JP;
Takashi Hakoda, Nagano-ken, JP;
Kiyoshi Nakamura, Nagano-ken, JP;
Susumu Morozumi, Nagano-ken, JP;
Nissei Plastic Industrial Co., Ltd., Nagano-Ken, JP;
Abstract
When test molding is performed by sequentially clamping a mold with a mold clamping force (100%, 80%, 70%, . . .) obtained by sequentially lowering a mold clamping force by a predetermined amount from the maximum mold clamping force (100%), a mold clamping pressure Pc in an injection process is detected and a plurality of different monitored elements (Pc, Pcd and Per) corresponding to the variation of the mold clamping pressure Pc are monitored, and thus it is detected that at least one of the monitored elements is varied to exceed a predetermined threshold, a mold clamping force obtained by increasing a mold clamping force at the time of the production of the variation by a predetermined amount is set as a proper mold clamping force Fs.