The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Aug. 14, 2009
Kikuo Matsuoka, Yokohama, JP;
Shinji Tanaka, Yokohama, JP;
Yasuyo Sano, Boston, MA (US);
Toshihiro Takai, Aichi-Gun, JP;
Kenichi Mizoguchi, Aichi-Gun, JP;
Hideki Usami, Aichi-Gun, JP;
Tomoaki Haruta, Chuo-Ku, JP;
Kikuo Matsuoka, Yokohama, JP;
Shinji Tanaka, Yokohama, JP;
Yasuyo Sano, Boston, MA (US);
Toshihiro Takai, Aichi-Gun, JP;
Kenichi Mizoguchi, Aichi-Gun, JP;
Hideki Usami, Aichi-Gun, JP;
Tomoaki Haruta, Chuo-Ku, JP;
Toyo Seikan Kaisha, Ltd., Chiyoda-Ku, JP;
Asano Laboratories Co., Ltd., Aichi-Gun, JP;
Abstract
An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure includes the steps of: compressing and deforming the multilayer structure, while extending respective layers of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer and surface resin layers of the multilayer structure to the abutting portion A of the push cutter and the cutter receiving portion.