The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Jan. 19, 2010
Brian Robert Brown, Balmain, AU;
Norman Micheal Berry, Balmain, AU;
Garry Raymond Jackson, Balmain, AU;
Paul Timothy Sharp, Balmain, AU;
John Douglas Peter Morgan, Balmain, AU;
Kia Silverbrook, Balmain, AU;
Akira Nakazawa, Balmain, AU;
Michael John Hudson, Balmain, AU;
Christopher Hibbard, Balmain, AU;
Samuel George Mallinson, Balmain, AU;
Paul Justin Reichl, Balmain, AU;
Brian Robert Brown, Balmain, AU;
Norman Micheal Berry, Balmain, AU;
Garry Raymond Jackson, Balmain, AU;
Paul Timothy Sharp, Balmain, AU;
John Douglas Peter Morgan, Balmain, AU;
Kia Silverbrook, Balmain, AU;
Akira Nakazawa, Balmain, AU;
Michael John Hudson, Balmain, AU;
Christopher Hibbard, Balmain, AU;
Samuel George Mallinson, Balmain, AU;
Paul Justin Reichl, Balmain, AU;
Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;
Abstract
A printhead is provided for an inkjet printer that has a print engine controller for receiving print data and sending it to the printhead. The printhead has a printhead IC for ejecting ink and a support structure for mounting the printhead IC in the printer adjacent a paper path. The printhead IC is mounted on a face of the support structure that, in use, faces the paper path. A flexible printed circuit board (flex PCB) that has contacts for receiving print data mounted to the support structure on a face that does not face the paper path. The bent section reduces the likelihood of trace cracking by holding the flex PCB at a set radius rather than allowing the flex to follow an irregular curve and thereby risking localized points of high stress on the traces.