The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2011
Filed:
Mar. 30, 2007
BO Soon Chang, Cupertino, CA (US);
Bo Soon Chang, Cupertino, CA (US);
Cypress Semiconductor Corporation, San Jose, CA (US);
Abstract
A semiconductor device package, a method of fabricating a semiconductor device package and a method of testing an integrated circuit utilizing a semiconductor device package are disclosed. Embodiments create a flip-flop semiconductor device package by coupling a semiconductor device, with a wire-bonded arrangement of conductive pads, in a face-up orientation beneath etched portions of multiple leadfingers. The flip-flop package offers improved signaling properties, durability, reliability, and package density at reduced cost given that the conductive pads of the device couple directly to the leadfingers, without requiring the manufacture of a new device or the rerouting of signal paths. The height of the package is also reduced by utilizing space beneath the etched portions of the leadfingers that was unused in conventional solutions. Additionally, the flip-flop configuration provides convenient means for exposing surfaces of the device and/or surfaces of the leadfingers.