The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2011
Filed:
Mar. 30, 2007
BO Soon Chang, Cupertino, CA (US);
Bo Soon Chang, Cupertino, CA (US);
Cypress Semiconductor Corporation, San Jose, CA (US);
Abstract
A semiconductor device package, a method of fabricating a semiconductor device package and a method of testing an integrated circuit utilizing a semiconductor device package are disclosed. Embodiments create a flip-flop semiconductor device package by coupling multiple leadfingers to conductive pads of a semiconductor device using an interposer with electrically conductive traces. The semiconductor device may be positioned in a face-up orientation between the leadfingers such that a single surface of the interposer may couple to both the semiconductor device and the leadfingers. The flip-flop package offers improved signaling properties, durability, reliability, and package density at reduced cost given that the interposer is configurable, the traces offer more reliable and durable interconnections, the interposer enables use of a smaller semiconductor device with a higher density conductive pad arrangement to decrease package density, and the interposer is relatively inexpensive.