The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2011

Filed:

Mar. 22, 2007
Applicants:

Ching-pang Lee, Cincinnati, OH (US);

Bin Wei, Mechanicville, NY (US);

Chen-yu Jack Chou, Cincinnati, OH (US);

Inventors:

Ching-Pang Lee, Cincinnati, OH (US);

Bin Wei, Mechanicville, NY (US);

Chen-Yu Jack Chou, Cincinnati, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23H 9/14 (2006.01); B23H 3/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for forming holes in an object is provided. The method includes providing an electrochemical machining (ECM) electrode including a first section having insulation that circumscribes the first section, and a second section having insulation that extends only partially around the second section. The method also includes inserting the electrode into the object, such that in a single pass the electrode forms a hole that includes a first portion having a first cross-sectional area and a second portion having a second cross-sectional area.


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