The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2011

Filed:

Mar. 03, 2009
Applicants:

Chia-wei Fan, Tu-cheng, TW;

Nan-hung Lin, Tu-cheng, TW;

Fu-pin Hsieh, Tu-cheng, TW;

Inventors:

Chia-Wei Fan, Tu-cheng, TW;

Nan-Hung Lin, Tu-cheng, TW;

Fu-Pin Hsieh, Tu-cheng, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01);
U.S. Cl.
CPC ...
Abstract

A socket, for electrically connecting an IC package with gaps on two sides thereof and a printed circuit board, comprises an insulative housing, a plurality of contacts received in the insulative housing and a pair of engaging clumps. The insulative housing has a bottom wall and a plurality of sidewalls upwardly extending from the bottom wall, the sidewalls and the bottom wall together define a space for the IC package, two opposed sidewall further have engaging slots. The engaging clump is received in the engaging slot, and has a post entering into the space to engaging with the gap of the IC package and a transverse arm abutting against and position the IC package.


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