The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2011
Filed:
Jan. 18, 2005
Armin Maul, Grebenheim/Nösberts, DE;
Thorsten Herbert, Mömbris, DE;
Jürgen Weber, Kleinostheim, DE;
Waltraud Werdecker, Hanau, DE;
Rolf Gerhardt, Hammersbach, DE;
Armin Maul, Grebenheim/Nösberts, DE;
Thorsten Herbert, Mömbris, DE;
Jürgen Weber, Kleinostheim, DE;
Waltraud Werdecker, Hanau, DE;
Rolf Gerhardt, Hammersbach, DE;
Heraeus Quarzglas GmbH & Co. KG, Hanau, DE;
Abstract
In a known method for bonding components made of material with a high silicic acid content by means of a substance to substance bond, a SiO-containing bonding mass is formed between connecting surfaces of the components. In order to provide for cost-efficient manufacture of a thermally stable composite, the invention proposes to generate a SiO-containing bonding mass that is generic with regard to the material with a high silicic acid content, comprising the following procedural steps: provision of a slurry containing amorphous SiOparticles; formation of a slurry mass between the connecting surfaces which are fixed in position with regard to each other; drying of the slurry mass; and solidification of the slurry mass by heating under formation of the SiO-containing bonding mass. A component assembly manufactured according to the method of the invention shows high temperature resistance and thermal fatigue resistance and can also be used in contamination-sensitive applications. The component assembly is characterized by an amorphous SiO-containing bonding mass, whose chemical composition is generic with regard to the material with the high silicic acid content of the basic material of the components, whereby the specific density of the SiO-containing bonding mass is at least 2.0 g/cm.