The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2011
Filed:
May. 11, 2007
Hiroki Yamasaki, Toyota, JP;
Yuan Zhong, Nagoya, JP;
Noritaka Takagi, Kasugai, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;
Abstract
A molded-component characteristic estimation device that estimates the stress-strain curve of each portion of a molded-component includes a storage unit that stores correlation data showing the correlation between solidification time and mechanical characteristics of a material for the molded-component; and a controller that estimates solidification time of each portion of the molded-component using a shape model of the molded-component, calculates a mechanical characteristic value of each portion based on the correlation data and the estimated solidification time, and estimates the stress-strain curve of each portion of the molded-component based on the calculated mechanical characteristic value. With this device, the stress-strain curve of each portion of the molded-component is estimated without actual measurement.